Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-13B5L/PA Double side lapping/polishing machine

  This machine is suitable for lapping and polishing of semi-conductor material, metal, and non -metal parts such as valve plate, rigid seal pad, piston ring, sapphire, and glass, as well as ultra-thin and fragile parts, such as quartz crystal.

  Two motors. Carriers rotate between upper and lower plates. Both sides of work pieces can be evenly lapped. 
Ring gear position is adjustable by jog operation. 
Variable frequency speed governor realizes soft start, and soft stop. Machine can work under any speed which is within setting range. Speed changing is stable, and with no impact. 
Mechanical safety device prevents upper plate from falling down. 
Carriers can rotate clockwise and counter-clockwise by adjusting sun gear speed. It will realize plate conditioning.

Upper and Lower plate size:849×φ274×30(mm) 

Thickness of workpiece:Max:30(mm)   Min:0.3(mm)

Dimensions of workpiece:Max:φ270(mm)

Lower plate rotational speed:0~60(rpm)

Number of carriers:5

Carrier specifications:British System::Z=150  Dp=12

Upper plate pressure range:10~180(Kg)

Power supply/power consumption:3 phase-380V/9KVA

Air supply/Air consumption:0.5(Mpa)/30(L/min)

Machine dimensions:1500×1250×2780(mm)

Machine net weight:~3000(Kg)

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