Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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Your present location:HOME >> Products >> Double-side lapping/polishing machine series >> YJ-16B5L╱PE Double side lapping/polishing machine
  • Name: YJ-16B5L╱PE Double side lapping/polishing machine

  This machine is suitable for double-side precision lapping and polishing of silicon wafer, crystal quartz wafer, sapphire wafer, optical crystal, optical glass, lithium niobium acid, ceramic wafer, and other hard and fragile materials.

  Two motors. Carriers rotate between upper and lower plates. Both sides of work pieces can be evenly lapped.
User-friendly operation. The height of operation panel is within 1050mm.
Ring gear and sun gear position is adjustable by jog operation.
Mechanical safety device prevents upper plate from falling down.
Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing. It will realize plate conditioning.



Upper and Lower plate size

Dowel pin tooth:φ1140×φ375×45(mm)
Involute gear:φ1128×φ362×50(mm)

Thickness of workpiece

Max:35(mm)  Min:0.4(mm)

Dimensions of workpiece


Lower plate rotational speed


Number of carriers


Upper plate up and down stroke


Upper plate pressure range


Power supply/power consumption

3 phase-380V/18KVA

Air supply/Air consumption


Machine dimensions


Machine net weight


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