Hunan Yujing Machinery Co., Ltd.   |  stock 002943

 OA E-mail  

Your present location:HOME >> Products >> Double-side lapping/polishing machine series >> YJ-16B5L╱PE Double side lapping/polishing machine
  • Name: YJ-16B5L╱PE Double side lapping/polishing machine

  This machine is suitable for double-side precision lapping and polishing of silicon wafer, crystal quartz wafer, sapphire wafer, optical crystal, optical glass, lithium niobium acid, ceramic wafer, and other hard and fragile materials.
 

  Two motors. Carriers rotate between upper and lower plates. Both sides of work pieces can be evenly lapped.
User-friendly operation. The height of operation panel is within 1050mm.
Ring gear and sun gear position is adjustable by jog operation.
Mechanical safety device prevents upper plate from falling down.
Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing. It will realize plate conditioning.

ITEM

SPEC

Upper and Lower plate size

Dowel pin tooth:φ1140×φ375×45(mm)
Involute gear:φ1128×φ362×50(mm)

Thickness of workpiece

Max:35(mm)  Min:0.4(mm)

Dimensions of workpiece

Max:380(mm)

Lower plate rotational speed

0~55(rpm)

Number of carriers

5

Upper plate up and down stroke

0~450(mm)

Upper plate pressure range

0~500(Kg)

Power supply/power consumption

3 phase-380V/18KVA

Air supply/Air consumption

0.5(Mpa)/30(L/min)

Machine dimensions

2142×1542×2650(mm)

Machine net weight

~5500(Kg)

download attachments :