Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-22B5L╱PA Double side lapping/polishing machine

  This machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials.

  Four motors control the upper plate, lower plate, ring gear and sun gear separately.
The length of the drive shaft is effectively shortened, mechanical rigidity of the machine is increased.
Ring gear and sun gear position is adjustable by jog operation.
Mechanical safety device prevents upper plate from falling down.
Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing.
 

ITEM

SPEC

Upper and Lower plate size

φ1458×φ498×50(mm)

Thickness of workpiece

Max:40(mm)  Min:0.6(mm)

Dimensions of workpiece

Max:480(mm)

Lower plate rotational speed

0~50(rpm)

Number of carriers

5

Carrier specifications

Z=184   Mn=3

Upper plate pressure range

20~780(Kg)

Power supply/power consumption

3 phase-380V/38KVA

Air supply/Air consumption

0.5(Mpa)/30(L/min)

Machine dimensions

2950×2000×2950(mm)

Machine net weight

~9000(Kg)

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