Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-SP139A Double side polishing machine

  This machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc.
 

  Instant working information displays on touch screen. All parameters can be set by the touch screen.
Upper and lower polishing plate both equipped with cooling device. It helps to adjust plate temperature and reduce plate deformation.
Machine frame and main bearing parts adopt one piece casting, the bearing capacity and the shock absorption ability of the machine is increased.
The use of cylindrical pin gear, reducing the cost of consumable parts.
Unique mechanical structure can bear the working pressure of up to 2000KG.

ITEM

SPEC

Upper and Lower plate size

φ1216×φ651×80(mm)

Lower plate rotational speed

0~60(rpm)

Thickness of workpiece

Max:20(mm)  Min:0.3(mm)

Dimensions of workpiece

Max:280(mm)

Upper plate pressure range

50~1000(Kg)

Number of carriers

9

Carrier specifications

Z=61  Df=307.14

Power supply/power consumption

3 phase-380V/24KVA

Air supply/Air consumption

0.5(Mpa)/50(L/min)

Machine dimensions

2020×2670×2800(mm)

Machine net weight

~6000(Kg)

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