Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-XQT1220A Multi wsire saw

  This saw is designed for cutting hard and fragile materials as well as magnetic material, diamond, crystal, and etc.

Two kinds of structures can be selected. One is equipped with four pieces of rollers, which is suitable for cutting wafers within the thickness from 5 to 20mm. The other one is equipped with two pieces of rollers and two big pulleys, which is suitable for cutting wafers within the thickness from 20mm to 60mm.
 
Max work size is 300mm×500mm×180mm; Max wire speed reaches 1300/min.
 
Motors drive the rollers directly. The holder of main spindle is connected to the frame of machine. It is of high precision and suitable for long time rotation under heavy load at a high speed.
 
Width of worktable is 300mm. It is uniquely designed for cutting structural ceramics, structural aluminum profile, silicon steel, magnetic core, metal frame by using diamond wire.
 
Cutting area is separated from wire supply and collection area. Only 10 pieces of big pulley lower down the risk of malfunction and wire break.
 
Equipped with whole set of servo control system and touch screen. Different cutting process can be preset.
 
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Max work size:
300×500×180(mm)
Worktable size:
300×500(mm)
Roller outer dia.×Effective length:
(Φ135~Φ155)×510(mm)
Wire Dia:
金刚线:φ0.12~φ0.25(mm)
Wire reciprocating speed:
400~1000(m/min)
Max speed:
1300(m/min)
Slurry tank volume:
160L
Thickness of slice:
5~60(mm)
Parallelism of slice:
0.02(mm)
Power supply/power consumption:
3 phase-380V/45KVA
Air supply/Air consumption:
0.4~0.65(Mpa)/600(L/min)
Machine dimensions:
3290×1900×2900(mm)
Machine net weight:
~5500(kg)
 

       

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