Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-13B6L/PA Double side lapping/polishing machine

  This machine is suitable for lapping and polishing of cell phone cover lens, silicon wafer, crystal quartz, optical crystal, optical glass, lithium niobium acid, gallium arsenide, ceramic wafer and other hard and fragile metal or non-metal materials.  

 Single motor. Carriers rotate between upper and lower plates. Both sides of work pieces can be evenly lapped.
The length of the drive shaft is effectively shortened, mechanical rigidity of the machine is increased.
Variable frequency speed governor realizes soft start, and soft stop. Machine can work under any speed which is within setting range. Speed changing is stable, and with no impact.
Mechanical safety device prevents upper plate from falling down.
Carriers can rotate clockwise and counter-clockwise by adjusting sun gear speed. It will realize plate conditioning.

 

Upper plate size:φ968×φ391×40(mm)

Lower plate size:φ968×φ391×35(mm)

Thickness of workpiece:Max:30(mm)    Min:0.3(mm)

Dimensions of workpiece:Max:φ270(mm)

Lower plate rotational speed:0~60(rpm)

Number of carriers:6

Carrier specifications:British System:Z=153 Dp=12  Dowel pin tooth::Z=63 Dp=16.32

Upper plate pressure range:10~250(Kg)

Power supply/power consumption:3 phase-380V/12KVA

Air supply/Air consumption:0.5(Mpa)/30(L/min)

Machine dimensions:1730×1150×2550(mm)

Machine net weight:~2500(Kg)

 

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