Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-16B5L/PC Double side lapping/polishing machine

  This machine is suitable for double-side precision lapping and polishing of silicon wafer, crystal quartz wafer, sapphire wafer, optical crystal, optical glass, lithium niobium acid, ceramic wafer, and other hard and fragile materials.    

  Four motors control the upper plate, lower plate, ring gear and sun gear separately.
The length of the drive shaft is effectively shortened, mechanical rigidity of the machine is increased.
Ring gear and sun gear position is adjustable by jog operation.
Mechanical safety device prevents upper plate from falling down.
Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing.

Upper and Lower plate size:φ1133×φ385×50(mm) 

Thickness of workpiece:Max:35(mm)    Min:0.4(mm)

Dimensions of workpiece:Max:φ370(mm)

Lower plate rotational speed:0~50(rpm)

Number of carriers:5

Carrier specifications:Z=142   Mn=3

Upper plate pressure range:20~500(Kg)

Power supply/power consumption:3 phase-380V/18KVA

Air supply/Air consumption:0.5(Mpa)/30(L/min)

Machine dimensions:2100×1500×2780(mm)

Machine net weight:~5500(Kg)

                 2-4英寸蓝宝石                                     直径为220DVD母片玻璃                          单晶硅

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