Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-20B5L/PA Double side lapping/polishing machine

 This machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials.

  Four motors control the upper plate, lower plate, ring gear and sun gear separately.
The length of the drive shaft is effectively shortened, mechanical rigidity of the machine is increased.
Ring gear and sun gear position is adjustable by jog operation.
Mechanical safety device prevents upper plate from falling down.
Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing.

Upper and Lower plate size
φ1355×φ457×50(mm) 
Thickness of workpiece
Max:φ40mm  Min:0.5(mm)
Dimensions of workpiece
Max:φ440(mm)
Lower plate rotational speed
0~50(rpm)
Number of carriers
5
Carrier specifications
Z=170    Mn=3
Upper plate pressure range
20~700(Kg)
Power supply/power consumption
3 phase-380V/30KVA
Air supply/Air consumption
0.5(Mpa)/30(L/min)
Machine dimensions
2650×1850×2750(mm)
Machine net weight
~8000(Kg)

                6英寸蓝宝石

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