Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-20B5L/PA Double side lapping/polishing machine

 This machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials.

  Four motors control the upper plate, lower plate, ring gear and sun gear separately.
The length of the drive shaft is effectively shortened, mechanical rigidity of the machine is increased.
Ring gear and sun gear position is adjustable by jog operation.
Mechanical safety device prevents upper plate from falling down.
Ring gear and sun gear speed is adjustable to realize carrier rotation direction changing.

Upper and Lower plate size
Thickness of workpiece
Max:φ40mm  Min:0.5(mm)
Dimensions of workpiece
Lower plate rotational speed
Number of carriers
Carrier specifications
Z=170    Mn=3
Upper plate pressure range
Power supply/power consumption
3 phase-380V/30KVA
Air supply/Air consumption
Machine dimensions
Machine net weight


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