Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-9B5L/PD Double side lapping/polishing machine

  This machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc.

  Two motors. Carriers rotate between upper and lower plates. Both sides of work pieces can be evenly lapped.
Ring gear position is adjustable by jog operation.
Variable frequency speed governor realizes soft start, and soft stop. Machine can work under any speed which is within setting range. Speed changing is stable, and with no impact.
Mechanical safety device prevents upper plate from falling down.
Sun gear speed can be adjusted separately.

Upper and Lower plate size:Dowel pin tooth:φ622×φ222×40(mm)   Involute gear:φ622×φ222×30(mm) 

Thickness of workpiece:Max:20(mm)    Min:0.1(mm)

Dimensions of workpiece:Max:φ180(mm)

Lower plate rotational speed:0~60(rpm)

Number of carriers:5

Upper plate pressure range:5~150(Kg)

Power supply/power consumption:3 phase-380V/6.5KVA

Air supply/Air consumption:0.5(Mpa)/30(L/min)

Machine dimensions:1360×1170×2430(mm)

Machine net weight:~2000(Kg)


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