Hunan Yujing Machinery Co., Ltd.   |  stock 002943

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  • Name: YJ-9.6B10L/PA Double side lapping/polishing machine

  This machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc.

  Single motor. Carriers rotate between upper and lower plates. Both sides of work pieces can be evenly lapped.
Ring gear position is adjustable by jog operation.
Variable frequency speed governor realizes soft start, and soft stop. Machine can work under any speed which is within setting range. Speed changing is stable, and with no impact.
Carriers can rotate clockwise and counter-clockwise by adjusting sun gear speed. It will realize plate conditioning.

Upper and Lower plate size:φ600×φ360×23(30)(mm) 

Thickness of workpiece:Max:20(mm)    Min:0.06(mm)

Dimensions of workpiece:Max:φ100(mm)

Lower plate rotational speed:0~60(rpm)

Number of carriers:10

Carrier specifications:Metric System:Z=70 Mn=2    British System::Z=66 Dp=12

Upper plate pressure range:10~60(Kg)

Power supply/power consumption:3 phase-380V/6KVA

Air supply/Air consumption:0.5(Mpa)/30(L/min)

Machine dimensions:1500×1000×2200(mm)

Machine net weight:~1980(Kg)

 

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