Multi wire cutting machine

YJ-XQL850B

Max cutting material size：170×170×900mm
Cutting speed：2100m/min
Weight：14500kg
The machine is uniquely designed for cutting solar crystalline silicon, polycrystalline silicon, with a size of 170mm×170mm.

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Product description

Parameters

High speed and high precision spindle system. Wire speed can reach 2100 m/min(Max 2400m/min),390 mm roller span reduces the bending height of wire web. Width of wire web is 900mm.
Minimum dia. of wire is 0.045~0.065mm. It minimizes material lost and realizes maximum output.
Cylinder clamping device ensures a safe and reliable material clamping. It is easy to operate.
U-shaped wiring structure and 6 pulleys reduces the risk of malfunction and wire broken. Maintenance time and cost is reduced.
Equipped with high efficiency cooling system. Separate wiring system, electrical system, and cooling system ensures easy operation, convenient maintenance and excellent heat dissipation.
Plate type heat exchanger is detachable. It is of high heat exchange rate, and it is easy to clean and maintenance.
Electric proportional valve cooperates with temperature sensor, can precisely control the temperature of cutting fluid. Temperature control of main bearing box ensures a long service life of the box and precise cutting result.

ITEM	SPEC
Max cutting material size	170×170×900mm
Outer roller diameter*Spacing	Φ190~200×390mm
Wire diameter	φ0.045~φ0.25mm
Cycle index	Up to 6 times/min
Cutting speed	2100m/min
Lifting stroke	≤280mm
Cutting feed rate	0.1~10mm/ min
Fast feed rate	0~300mm/min
Full-load power	85kw
Size(L×W×H)	4350mm×1965mm×2960mm
Weight	14500kg
Equipment requires ground load	2500Kg/㎡